A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages. This two to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once bonded with this product, an electronic package and/or bonded surface will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
Overview
A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages. This two to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once bonded with this product, an electronic package and/or bonded surface will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages. This two to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once bonded with this product, an electronic package and/or bonded surface will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
Overview
A low viscosity, transparent, two-part epoxy system designed to be used as a room temperature curing adhesive and encapsulant for small to medium sized electronic packages. This two to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once bonded with this product, an electronic package and/or bonded surface will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
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