A green, two-part, thixotropic epoxy adhesive that cures at room temperature. It is designed for non-sag structural bonding application that requires a room temperature curing epoxy with low shrinkage, good shock resistance and excellent mechanical and electrical properties as well as good toleration to moisture or damp surface while bonding. It cures to form tough bonds to metals, phenolic plastics, polymers, glass, FRP’s, hard boards, wood, ceramics, rubber and masonry materials. It is an excellent electric insulator and provides superior resistance to vapors, gases, water, galvanic action, petroleum fuels and salt solutions.
Overview
A green, two-part, thixotropic epoxy adhesive that cures at room temperature. It is designed for non-sag structural bonding application that requires a room temperature curing epoxy with low shrinkage, good shock resistance and excellent mechanical and electrical properties as well as good toleration to moisture or damp surface while bonding. It cures to form tough bonds to metals, phenolic plastics, polymers, glass, FRP’s, hard boards, wood, ceramics, rubber and masonry materials. It is an excellent electric insulator and provides superior resistance to vapors, gases, water, galvanic action, petroleum fuels and salt solutions.
A green, two-part, thixotropic epoxy adhesive that cures at room temperature. It is designed for non-sag structural bonding application that requires a room temperature curing epoxy with low shrinkage, good shock resistance and excellent mechanical and electrical properties as well as good toleration to moisture or damp surface while bonding. It cures to form tough bonds to metals, phenolic plastics, polymers, glass, FRP’s, hard boards, wood, ceramics, rubber and masonry materials. It is an excellent electric insulator and provides superior resistance to vapors, gases, water, galvanic action, petroleum fuels and salt solutions.
Overview
A green, two-part, thixotropic epoxy adhesive that cures at room temperature. It is designed for non-sag structural bonding application that requires a room temperature curing epoxy with low shrinkage, good shock resistance and excellent mechanical and electrical properties as well as good toleration to moisture or damp surface while bonding. It cures to form tough bonds to metals, phenolic plastics, polymers, glass, FRP’s, hard boards, wood, ceramics, rubber and masonry materials. It is an excellent electric insulator and provides superior resistance to vapors, gases, water, galvanic action, petroleum fuels and salt solutions.
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