Adhesives and Encapsulants

Chase Corporation offers a comprehensive range of adhesives and encapsulants with advanced materials providing strong bonding, environmental protection, and electrical insulation, ensuring long-term reliability.

an electronic circuit board with water on it

Reliable Protection Coverage for PCB Assemblies

Chase Corporation’s HumiSeal and Resin Designs encapsulants deliver advanced protection for PCBs and sensitive components. By resisting moisture and corrosion, absorbing mechanical shock, and ensuring electrical insulation, they safeguard electronics for consistent performance in harsh conditions. Their low shrinkage and durable design maintain structural integrity while reducing stress on delicate components. Choose solutions that provide precision and confidence for professional applications.

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Adhesive Solutions for Precision Bonding

Chase Corporation’s UV and epoxy adhesives offer distinct benefits tailored to specific applications. UV adhesives cure rapidly under ultraviolet light, ensuring efficiency for glass, optical bonding, and electronics assembly. Epoxy adhesives deliver exceptional strength, chemical resistance, and long-term durability, making them ideal for structural bonding and encapsulation. Each option provides reliable performance and application flexibility to meet diverse industrial needs.

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Adhesive Options for Simplified Application and Strength

Chase Corporation offers one-component and two-component adhesives tailored to diverse industrial needs. One-component adhesives simplify application with pre-mixed formulations that cure efficiently using heat, moisture, or UV exposure, making them ideal for automated processes. Two-component adhesives, mixed at the point of use, deliver exceptional bonding strength, chemical resistance, and durability, ensuring reliability for demanding structural applications. Explore advanced adhesive solutions designed to maximize efficiency and performance.

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Curable Adhesives vs. Film Adhesives: Choosing the Right Bonding Solution

Adhesives play a critical role in product assembly, providing strength, durability, and environmental resistance. Depending on application needs, manufacturers can choose between curable adhesives, which require UV, heat, or moisture to solidify, and film adhesives, which offer pre-formed bonding without curing.

Featured Prodcuts:

Curable Adhesives

Liquid adhesives that harden through curing, offering strong bonds and excellent environmental resistance for various substrates.

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Film Adhesives

Pre-formed adhesives that provide precise, uniform bonding with no curing required, ensuring clean and efficient application.

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Superior Optical Clarity with Liquid Optically Clear Adhesives (LOCA

Liquid Optically Clear Adhesives (LOCA) play a critical role in LCD and touchscreen assembly, ensuring exceptional optical clarity, durability, and long-term performance. Poorly designed adhesives can lead to haze, light refraction, and clarity issues, reducing display quality over time. HumiSeal’s advanced LOCA formulations eliminate these risks with precise chemical balance, unmatched adhesion, and compatibility with edge-sealing materials, ensuring crystal-clear displays that stand the test of time.

Features and Benefits

Exceptional Clarity

Efficient Processing

Strong & Flexible Bonding

Customizable Solutions

ThermoSink: Advanced Thermal Encapsulation for Electronics Protection

ThermoSink thermally conductive polymers provide efficient heat dissipation while encapsulating and protecting sensitive electronics. Designed for high-performance PCB applications, ThermoSink formulations balance thermal conductivity, flow properties, and durability to ensure long-lasting reliability. With options across epoxy, silicone, and urethane chemistries, ThermoSink materials allow engineers to optimize temperature resistance, hardness, and flexibility for their specific needs.

The right encapsulant protects electronics from extreme operating conditions, including thermal, mechanical and electrical stress. Heat, especially, is one of the top reasons electronics fail.

The ThermoSink family covers a wide range of performance characteristics. Choosing the right coating should consider PCB surface energy, exothermic release during cure, desired chemistry, and material hardness.

ThermoSink 35-7 offers superior flow, self-leveling, bubble dispersion, and high-speed curing.